Considered a niche technology in the recent past, embedded component technology is rapidly gaining ground as a vehicle for miniaturization and cost containment. To help the electronics industry keep pace with growing interest in embedded components, IPC – Association Connecting Electronics Industries® announces an ambitious technical agenda for the IPC/FED Conference on Embedded Components. The event, developed in collaboration with Fachverband Elektronik-Design e.V. (FED), will take place June 4-5, 2013, at the Hotel InterContinental Frankfurt in Frankfurt, Germany.

“Embedded components are gaining more interest from our customer base, since it is one way to miniaturize electronics,” says Dirk Müller of FlowCAD EDA-Software Vertriebs GmbH, who will present at the conference. “We see requests from medical, industrial sensors, mobile devices, and initial interest in automotive for special applications.”

Designed to offer information of value to engineers, designers, sales, and marketing professionals and decision-makers interested in embedded components technology, the conference features 14 presentations highlighting reliability, test, assembly issues, and new manufacturing methods.

Sessions on June 4 will address a range of topics, including: The future of embedded component technology, presented by Jürgen Wolf, Würth Elektronik; embedded optical waveguides in PCBs, presented by Happy Holden, Gentex; embedded technologies introduction and overview, presented by Andreas Ostmann, Fraunhofer, IZM; using Z-dimension for functional density in mobile multimedia devices, presented by Hemant Shah, Cadence Design Systems, Inc.; requirements for embedded components pick-and-place technology, presented by Sjef van Gastel and Patrick Huberts, both of Assembléon; designing with and for embedded components, presented by Ralf Brüning, Zuken; and design and assembly process implementation, presented by Vern Solberg, Invensas.

On June 5, participants can attend sessions on: design flow for embedded actives, presented by Per Viklund, Mentor Graphics; embedded technology in serial production, presented by Mike Morianz, AT&S; embedding passives and active components in rigid-flex PCBs, presented by Michael Matthes of Wittenstein Electronics GmbH and Dirk Müller of FlowCad; development challenges and reliability for next generation products, presented by Paul Wang, MiTac; embedded ultra-thin chip packaging, presented by Jan Vanfletern, IMEC; embedding and mass production, presented by Christian Rössle, Schweizer Electronic AG; and flex-based embedded die 3D-SiP technology, presented by Ted Tessier, FlipChip International.

In addition to the technical program, the conference will include a tabletop exhibition showcasing industry suppliers who will be available to answer questions on embedded component technology. A networking reception and luncheons are also planned.