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4 layer PCB with BGA

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Product Abstract:

1. Base material: FR4 tg135 2. Board thickness: 1.6mm 3. Copper thickness: 1oz/0.5oz 4. Surface finish: Gold immersion


Product Description

Shenzhen Upprising Electronics Co., Ltd

1. Base material: FR4 tg135

2. Layer: 4

3. Board thickness: 1.6mm

4. Copper thickness: 1 oz / 0.5 oz

5. Surface finish: Gold immersion

6. Special Tech: BGA

7. Solder mask/ Silkscreen: Blue / White

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